| Test Item | Technical parameter required | Test method |
| Appearance * |
Surface is flat and smooth,
non-wrinkle and defect, No colour change under temperature |
By visual |
| Tolerance for white coating. * | 19~21um | Corporation QC |
| Tolerance for adh. * | 24~26um ( A906 ) | Corporation QC |
|
Dimensional stability
*
:
Paper removed Paper removed+Heat treatment |
(
TD/MD
):
± 0.10 % ± 0.15% |
(
TD/MD
):
± 0.15 % ± 0.15% |
|
Peel strength
*
:
1:as received ( ≥ ) 2:dip soldering ( ≥ ) |
unit
:
Kgf/cm
0.9 0.9 |
IPC-TM-650-2.4.9
Method B &C |
| Dip weldability * | 300 ºC, 30s | IPC-TM-650-2.4.13 |
| Adhesive fluidity * | 0.06~0.12mm | IPC-TM-650-2.3.17 |
| Adhesive flammability | V-0 | UL 94V-0 |
| Chemical resistance | ≥ 90% | IPC-TM-650-2.3.2 |
| hygroscopicity | ≤ 4.0% | IPC-TM-650-2.6.2 |
| Adhesive temperature | 95~115 ºC | Melting point bar test |
| Dielectric constant ( 1 MHz ) | ≤ 3.6 | IPC-TM-650-2.5.5.3 |
| Dielectric loss factor ( 1 MHz ) | 0.04 | IPC-TM-650-2.5.5.3 |
| Dielectric strength | 800 KV/cm | ASTM-D-149 |
| Tensile strength | 120 MPa | ASTM-D-882 |
| Press method | Press temp. | Pressure | Time for press | Temp.for de-pressure |
| laminating | 160 ºC ~175 ºC | 15~20 kgf/cm 2 | 45~60 mins | Under 60 ºC |
| Fast press | 170 ºC ~185 ºC | 20~30 kgf/cm 2 | 2~3 mins |
Need
Post-processing |