A dhesive thickness | 12.5um,15um,20um, 25um etc.( more can be provided as request ) |
A dhesive supplier | US, Japan and Taiwan etc. |
P I film thickness | 25um , 50 um and 7 5um etc. ( more can be provided as request ) |
P I film supplier | Dupont, Kanake, Kolong, Taiwan and mainland of China |
Press mathod | P ress tem. | P ressure | T ime for press | Temp. for de-pressure |
L aminating | 160ºC~1 75 ºC | 1 5 ~ 20 kgf/cm 2 | 45~60 mins | U nder 60ºC |
F ast mathod | 1 7 0ºC~1 85 ºC | 20 ~ 30 kgf/cm 2 | 2 ~ 3 mins | N eed P ost-treatment |
Property | 25umPI + 25umAd | 12umPI + 15umAd | Mothed |
Adh. appearance * |
Surface is flat and smooth,
non-wrinkle and defect. |
V isual inspection | |
T olerance for adh.* | 24~27um | 14~17um | FW testing mothed |
Dimensional stability * ( MD/TD ) | ±0.15 % | ±0.15% | IPC-TM-650-2.2.4 |
Peel strength*
A s received After sold float |
0.9 Kgf/cm 0.9 Kgf/cm |
0.7 Kgf/cm 0.7 Kgf/cm |
IPC-TM-650-2.4.9
B, C |
Solder float * | 288ºC , 30 sec, Pass | IPC-TM-650-2.4.13 | |
Adh. flowability* | 0.06~0.12mm | 0.06~0.12mm | IPC-TM-650-2.3.17 |
Volatile content* | ≤3.0% | IPC-TM-650-2.6.2 | |
Flammability | P ass | P ass | UL 94VTM-0 |
Chemical resistance | ≥ 90% | ≥ 90% | IPC-TM-650-2.3.2 |
Moisture absorption | ≤4.0% | ≤4.0% | IPC-TM-650-2.6.2 |
Tacky temp. | 95~115ºC | 95~115ºC | M elt bar |
Dielectric constant (1MHz) | 3.75 | 3.75 | IPC-TM-650-2.5.5.3 |
Dissipation factor (1MHz) | 0.04 | 0.04 | IPC-TM-650-2.5.5.3 |
Dielectric strength | 800 KV/cm | 800 KV/cm | ASTM-D-149 |
Tensile strength | 120 MPa | 120 MPa | ASTM-D-882 |