6Layer Flex-rigid PCB
Number of layers: 6Layers
Thickness: 1.6mm+0.12mm
Material: FR4 +PI+ NFPP
Min. Drilling Size: 0.2mm
Min. Trace width: 0.1mm
Min. Space: 0.1mm
Surface Finish: Immersion Gold
| Parameters | Rigid-flex PCBs |
| Standard Panel Size | 500x600mm |
| Copper Thickness | 6 OZ |
| Final Thickness | 0.06-6.0mm |
| Layer Count | Up to 20L |
| Material | PI, PET, PEN, FR4, PI |
| Min Line Width/Spacing | 3/3mil |
| Min Drill Hole Size | 6mil |
| Min Via (Laser)Size | 4mil |
| Min Micro Via (Laser)Size | 4mil |
| Min Slot Size | 24milx35mil (0.6x0.9mm) |
| Min Hole Ring | |
| Inner 1/2OZ | 4mil (0.10 mm) |
| Inner 1OZ | 5mil (0.13 mm) |
| Inner 2OZ | 7mil (0.18mm) |
| Outer 1/3-1/2OZ | 5mil (0.13 mm) |
| Outer 1OZ | 5mil (0.13 mm) |
| Outer 1OZ | 8mil (0.20mm) |
| Stiffener | |
| Stiffener Material | Polyimide/FR4 |
| PI Stiffener Registration | 10mil (0.25mm) |
| PI Stiffener Tolerance | 10% |
| FR4 Stiffener Registration | 10mil (0.25mm) |
| FR4 Stiffener Tolerance | 10% |
| Coverlay Color | White, Black, Yellow, Transparent |
| Surface Finish | |
| ENIG | Ni: 100-200μ'', Au: 1-4μ'' |
| OSP | 8-20μ'' |
| Immersion Silver | Silver: 6-12μ'' |
| Gold Plating | Ni: 100-200μ'', Au: 1-15μ'' |
| Outline Tolerance of Punch | |
| Precision Mould | +/-3mil (0.08 mm) |
| Ordinary Mould | +/-4mil (0.10 mm) |
| Knife Mould | +/-9mil (0.23 mm) |
| Hand Cutting | +/-16mil (0.41 mm) |
| Electrical Test Voltage | 50-300V |