Parameter | Value | Unit |
V DS | 650 | V |
I D, pulse | 96 | A |
R DS(ON), max @ V GS =10V | 99 | mΩ |
Q g | 66.6 | nC |
Product Name | Package | Marking |
OSG65R099HSZAF | TO247 | OSG65R099HSZA |
Parameter | Symbol | Value | Unit |
Drain-source voltage | V DS | 650 | V |
Gate-source voltage | V GS | ±30 | V |
Continuous drain current 1) , T C =25 °C |
I D |
32 |
A |
Continuous drain current 1) , T C =100 °C | 20 | ||
Pulsed drain current 2) , T C =25 °C | I D, pulse | 96 | A |
Continuous diode forward current 1) , T C =25 °C | I S | 32 | A |
Diode pulsed current 2) , T C =25 °C | I S, pulse | 96 | A |
Power dissipation 3) , T C =25 °C | P D | 278 | W |
Single pulsed avalanche energy 5) | E AS | 648 | mJ |
MOSFET dv/dt ruggedness, V DS =0…480 V | dv/dt | 50 | V/ns |
Reverse diode dv/dt, V DS =0…480 V, I SD ≤I D | dv/dt | 50 | V/ns |
Operation and storage temperature | T stg , T j | -55 to 150 | °C |
Parameter | Symbol | Value | Unit |
Thermal resistance, junction- case | R θJC | 0.45 | °C/W |
Thermal resistance, junction- ambient 4) | R θJA | 62 | °C/W |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Drain-source breakdown voltage | BV DSS | 650 | V | V GS =0 V, I D =1 mA | ||
Gate threshold voltage | V GS(th) | 3.0 | 4.5 | V | V DS =V GS , I D =1 mA | |
Drain-source on- state resistance |
R DS(ON) |
0.090 | 0.099 |
Ω |
V GS =10 V, I D =16 A | |
0.21 | V GS =10 V, I D =16 A, T j =150 °C | |||||
Gate-source leakage current |
I GSS |
100 |
nA |
V GS =30 V | ||
- 100 | V GS =-30 V | |||||
Drain-source leakage current | I DSS | 10 | μA | V DS =650 V, V GS =0 V | ||
Gate resistance | R G | 7.8 | Ω | ƒ=1 MHz, Open drain |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Input capacitance | C iss | 3988 | pF |
V GS =0 V, V DS =50 V, ƒ=100 kHz |
||
Output capacitance | C oss | 210 | pF | |||
Reverse transfer capacitance | C rss | 7.4 | pF | |||
Effective output capacitance, energy related | C o(er) | 124 | pF |
V GS =0 V, V DS =0 V-400 V |
||
Effective output capacitance, time related | C o(tr) | 585 | pF | |||
Turn-on delay time | t d(on) | 46.0 | ns |
V GS =10 V, V DS =400 V, R G =2 Ω, I D =20 A |
||
Rise time | t r | 60.3 | ns | |||
Turn-off delay time | t d(off) | 93.0 | ns | |||
Fall time | t f | 3.7 | ns |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Total gate charge | Q g | 66.6 | nC |
V GS =10 V, V DS =400 V, I D =20 A |
||
Gate-source charge | Q gs | 20.6 | nC | |||
Gate-drain charge | Q gd | 24.8 | nC | |||
Gate plateau voltage | V plateau | 6.7 | V |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Diode forward voltage | V SD | 1.3 | V | I S =32 A, V GS =0 V | ||
Reverse recovery time | t rr | 151.7 | ns |
I S =20 A, di/dt=100 A/μs |
||
Reverse recovery charge | Q rr | 1.0 | μC | |||
Peak reverse recovery current | I rrm | 12.3 | A |